Cadence® Allegro® Import in CST STUDIO SUITE™
The Cadence® import is initiated in Cadence Allegro® itself via the CST Allegro Plug-In. This allows the user to select an area, a net or an object in the layout or the full layout itself. Due to the potentially immense scale and complexity of circuit layouts it is important for the user to be able to control the size of the layout imported into CST MICROWAVE STUDIO® (CST MWS). An example of an Import is shown in Figure 1.
Figure 1: An imported Cadence® structure in CST MWS
An overview of the process and the supported features of the Cadence Allegro link is shown in Figure 2.
Figure 2: Cadence Allegro import process overview
Before the full layout, area or net is exported from Cadence Allegro the cross-sectional package information can be checked and adjusted. Figure 3 shows the cross-section configuration table where the layer material, type, thickness, elevation and electromagnetic properties are set. Specific layers can be selectively included or excluded from the export.
Figure 3: Layout Cross-Section Export in the CST Cadence Link
In a similar manner, the package information can also be edited as shown in Figure 4 where BGA, die and bond wire components' properties can be checked. The parameters for the component types such as solder ball radii, height, elevation etc. can be specified.
Figure 4: Package export : die, BGA and wirebond components
Figure 5 shows the full layout, area and net import possibilities for the structure import. All component names and material properties are included as a result of the cross-section and package setups. All components are editable and can also be deleted or modified.
Figure 5: Full Layout (top), area (left) and net (right) import possibilities
Finally, Figure 6 shows the feature where the structure can be automatically cleaned and healed. Since the PERFECT BOUNDARY APPROXIMATION, (PBA)(®) allows the efficient handling of rounded geometries, a facetted representation of these surfaces is not necessary. During the import process the user can control the level to which the healing is applied.
Figure 6: Automatic cleaning and healing of imported geometry
This article has only skimmed the surface of the very powerful import facilities available for Cadence Allegro structures which enable, with minimal user-interaction, the seamless importing of complicated multilayer and packaging structures.
CST Article "Cadence® Allegro® Import in CST STUDIO SUITE™"
last modified 19. Mar 2007 2:30
printed 15. May 2008 6:16, Article ID 316
URL:
All rights reserved.
Without prior written permission of CST, no part of this publication may be
reproduced by any method, be stored or transferred into an electronic data processing system, neither mechanical or by any other method.
Article ID: 316
Last modified: 19. Mar 2007 2:30
Other Articles
New, compact configurations for RF/microwave bandstop and lowpasss filters are presented. Compact footprints are achieved by folding the transmission lines in a microstrip platform. The effect of mutual coupling between the transmission lines, curved line sections, interconnecting lengths of the sections are taken into account to obtain the network parameters for the folded line filters. The folded line filters have practical dimensions for a wide range of electrical specifications, making physical implementation realizable. The filter designs have been validated by using full wave 3D EM simulation using CST MICROWAVE STUDIO®, as well as by comparison with the measurements. The new designs presented should prove useful for a host of embedded passive and RFIC applications in the 1-10 GHz range.
Read full article..
This paper shows how the frequency domain solver of CST MICROWAVE STUDIO® (CST MWS) can be used to calculate the near field distribution of metallic and dielectric objects at optical frequencies. This web paper is based on the publication “Theory of Nanometric Optical Tweezers” by Lukas Novotny, Randy X. Bian, and X. Sunney Xie, Physical Review Letters, Volume 79, No. 4, 28 July 1997.
Read full article..
The 3rd Dimension: This inductive, mostly planar structure contains an air bridge.
Read full article..
In this article the simulation of parasitic effects in a standard IC package is shown. The transient simulator in CST MICROWAVE STUDIO® (CST MWS) offers the advantage, that effects such as crosstalk and signal delay can be investigated in both time and frequency domain. Additionally, the simulation results can be used to generate an equivalent RLC network model that has the same S-Parameters as the 3D EM simulation but can be included in the overal circuit simulation of the logical parts of the IC.
Read full article..
Radio Frequency Identification Systems (RF-ID) are widely used and are thus one of the fastest growing sectors of todays radio industry, allowing advanced solutions for a variety of applications in the area of authentication, ticketing, access control, supply management, etc. One of the most common band allocated to RFID systems is 13.56 MHz. For this application example operating at this particular frequency band we have chosen a transponder inlay which was created using the ACIS based solid modeler of CST MICROWAVE STUDIO® The frequency domain solver of CST MICROWAVE STUDIO® has been applied to accurately predict the input impedance, followed by a lumped element based equivelent circuit derivation to describe the impedance versus frequency.
Read full article..