PCB and Multilayer

Full Package Signal Integrity Analysis

This article presents the use of CST MICROWAVE STUDIO® (CST MWS) for the simulation of large IC packages. From the time domain simulation network parameters can be extracted and further processed in CST DESIGN STUDIO™. Read full article..

Transient Simulation of a System-in-Package (SiP)

This article summarises the simulation of a System-in-Package (SiP) model using the CST MICROWAVE STUDIO® (CST MWS) Transient Solver to determine the S-Parameters, field distribution and system response when excited with 10 and 20 GHz pulses with additional noise signals. An analysis of the SiP with a board mounting and its effect on the is resonant frequency is also performed. The EMC behaviour of the SiP with and without the mounted board is also considered. Permission and courtesy of AET Inc. Japan. Read full article..

3D IR-Drop simulation of a complex multilayer PCB

This article deals with the simulation of the voltage drop for complex power delivery networks. Such a simulation is useful to the design engineer in order to ensure power integrity. With the help of the CST EM STUDIO™ stationary current solver the 3D distribution of the potential and current density on all layers of a complex PCB board can be easily determined. The static IR-Drop simulation is the primary focus in this article but a dynamic simulation would also be possible in CST MICROWAVE STUDIO®. Read full article..

Cadence® Allegro® Import in CST STUDIO SUITE™

An overview is given of the capabilities of the Cadence Allegro import feature in the CST STUDIO SUITE™. The user has full control over the layout export in Cadence itself and during the import process in CST STUDIO SUITE™. Cross-section and packaging export facilitites mean that layers, dies, and bond wires can be specified in the process. The imported structure is also subjected to an automatic cleaning and healing process to ensure an efficient simulation process. Depending on the size, complexity and required results, either the CST Time-Domain Solver or the Frequency Domain Solver may be used to establish the signal integrity of such layouts. Read full article..

Signal Integrity of Cadence Allegro® backplane trace import

A portion of a backplane, designed with the Cadence Allegro® layout tool, is imported into CST MICROWAVE STUDIO®. This section consists of a differential pair with vias which go through the board. The structure was analyzed in Microwave Studio. The simulation results demonstrate the impact of backdrilling the signal vias to improve the signal integrity performance. A detailed SPICE model of the transmission path is created and its accuracy is verified. Read full article..

Using CST MWS for Signal Integrity problems

This article is concerned with the important issue of Signal Integrity and the application of CST MICROWAVE STUDIO® to the investigation of the characterisation of an SMA connector on a multi-layer PCB. Read full article..

Cross-SSN analysis in multilayer Printed Circuit Boards

This article demonstrates how CST MICROWAVE STUDIO® has been applied to the Signal Integrity analysis of a multilayer PCB structure. Good agreement with measurement is shown as well as the results for a design suggestion to reduce coupling between planes. Read full article..

CMOS VCSEL Driver Design using CST MICROWAVE STUDIO® and Agilent ADS

CST MICROWAVE STUDIO® and Agilent ADS have been successfully employed in this OEIC driver design - an example of a high speed analog/broadband IC application.The package model was imported from Agilent momentum and the model was simulated upto a 100 GHz in CST MWS.The resulting eye diagrams of the driver design from CST MWS are compared with those from Agilent momentum and other test cases. Read full article..