PCB and Multilayer
A physically based method is used for estimating the equivalent circuit
model of an SMA connector soldered on the top plane of a multi-layer board and connected to a single-end stripline. Starting
from the scattering parameters (S-parameters) evaluated using a simulation software package, the equivalent circuit is extracted
by modeling each part of the structure. The circuit is then validated by comparing the outputs obtained via circuit-level simulation
of the extracted physical circuit with those computed by means of the full wave solution.
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CST MICROWAVE STUDIO® and Agilent ADS have been successfully employed in this OEIC driver design - an example of a high speed analog/broadband IC application.The package model was imported from Agilent momentum and the model was simulated upto a 100 GHz in CST MWS.The resulting eye diagrams of the driver design from CST MWS are compared with those from Agilent momentum and other test cases.
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