CST MICROSTRIPES® is a powerful electromagnetic simulation tool based on the 3D TLM method. Key benefits include direct time-domain analysis, highly efficient automatic multi-grid (Octree) meshing and special techniques for simulating thin panel diffusion, absorber reflection, leakage through seam/vent apertures and field/wire interactions. These capabilities are very relevant and sometimes essential for simulating electromagnetic interactions in electronics systems with enclosures and cabling, full vehicle-level analysis and systems integration.
Applications include: Electromagnetic Compatibility (EMC), Electromagnetic Interference (EMI), Electromagnetic Environmental Effects (E3), Electrostatic Discharge (ESD), Antenna Design, Co-Site Analysis and Installed Antenna Performance.
Simulation of E3 effects in rotorcraft
CST MICROSTRIPES® is now integrated into the CST STUDIO SUITE™ enabling users to run the TLM solver directly in the CST STUDIO SUITE™ modeling interface. The integration also makes it possible to run the 3D TLM field solver in true transient co-simulation with CST CABLE STUDIO® and CST DESIGN STUDIO™. This offers unique and ground-breaking electromagnetic simulation capability for Engineers facing challenging EMC/EMI and antenna problems.