Title:
A systematic procedure for the macromodelling of complex interconnects and packages
Author(s):
S. Grivet-Talocia, I. S. Stievano, F. G. Canavero, I. A. Maio
Source:
Proc. EMC Europe 2004, Int. Symp. Electromagnetic Compatibility Eindhoven, The Netherlands
Vol./Issue/Date:
Sep. 6–10
Year:
2004
Page(s):
414-419
Keywords:
Abstract:
This paper is focused on broadband
macromodeling of complex interconnect structures
characterized by many ports, like connectors, pack-
ages, via arrays. To be characterized, such struc-
tures require a large set of data either from mea-
surement or full-wave simulations. Therefore, the
generation of a macromodel starting from such
large dataset is a critical task when a high accuracy
over an extended bandwidth is required. Another
critical aspect in the macromodeling process is the
enforcement of passivity. A non-passive model is
hardly usable for practical analyses since it may
lead to unstable behavior depending on the termi-
nation networks.
This paper tries to overcome these difficul-
ties by splitting the port responses into sepa-
rate small subsets that are macromodeled indepen-
dently. Each partial macromodel is constructed
from transient responses using a Time-Domain
Vector Fitting algorithm. Then, the partial macro-
models are assembled into a global macromodel
for the entire structure, which is finally tested for
passivity. If non-passive, compensation is achieved
by spectral perturbation of associated Hamiltonian
matrices. Automatic synthesis of SPICE equiva-
lents can finally be performed, thus obtaining cir-
cuit representations that are ready to be used for
accurate and efficient system-level signal integrity
assessments. Some examples illustrate the high de-
gree of accuracy of the proposed approach.
Document:
Reference Id:
109
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