Title:
Characterization of via holes discontinuities by means of numerical de-embedding
Author(s):
Antonini, G.; Scogna, A.C.; Orlandi, A.;
Source:
IEEE International Symposium on Electromagnetic Compatibility (EMC 2003)
Vol./Issue/Date:
Volume 2, 18-22 Aug.
Year:
2003
Page(s):
591 - 596
Keywords:
Abstract:
A method for de-embedding scattering parameters S of a
via hole in multilayer printed circuit board is presented.
By assuming that the via hole is not electromagnetically
coupled with the adjacent lines, the scattering parameters
are evaluated starting from the calculation of the transfer
scattering matrix T obtained by a three dimensional full
wave analysis of the test structure. The numerical
approach used to obtain S and T parameters has been
validated by comparison with results computed by other
independent numerical methods and measurements. The
proposed methodology allows a computational time saving
and gives useful results for a CAD modeling of via hole
discontinuities
Document:
Reference Id:
128
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