Title:
Fewest Vias Design for Microstrip Guard Trace by Using Overlying Dielectric
Author(s):
Yung-Shou Cheng, Wei-Da Guo, Guang-Hwa Shiue, Hung-Hsiang Cheng, Chen-Chao Wang, Ruey-Beei Wu
Source:
Conference on Electrical Performance of Electronic Packaging
Vol./Issue/Date:
Year:
2006
Page(s):
321-324
Keywords:
Abstract:
The unwanted ringing noise owing to the resonance related to the spacing of shorting vias on microstrip guard traces might degrade the signal quality of adjacent interconnects. This paper proposes a novel design method to reduce the ringing noise by overlying a thin dielectric with higher dielectric constant onto the original microstrip substrate. It has the advantages of minimizing the
required number ofshorting vias and achieving less restricted circuit routing.
Document:
Reference Id:
449
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