Title:
Full-wave Characterisation of RF Ceramic Packages
Author(s):
Patrick Schuh, Horst Bilzer, Wolfgang Menzel, Jürgen Kiwitt and Maximilian Pitschi
Source:
Microwave Conference, 33rd European
Vol./Issue/Date:
Volume 2
Year:
2003
Page(s):
635 - 638
Keywords:
Abstract:
The characterization of small complex ceramic
packages with (monolithically) integrated microwave
circuits is investigated using full-wave methods. In order to
correctly design packaged radio frequency (RF) chips, the
consideration of the package has become an indispendible
part of the chip design process, as the electrical properties
of the package have a great impact on the performance of
the RF chips. For an effective simulation, a segmentation
between the chip and its immediate environment, such as,
the package, is investigated, and a suitable interface between
chip and package is proposed to prove the validity of the
interface, the simulation of the packaged RF device, which is
pieced together from the full-wave simulation of the package
and the simulation of the RF chip, is compared to the
corresponding measurement. Simulation and measurement
of the packaged RF device agree very well.
Document:
Reference Id:
117
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