Title:
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications
Author(s):
Francesco de Paulis, Leo Raimondo, Antonio Orlandi
Source:
IEEE Transactions on Advanced Packaging
Vol./Issue/Date:
Year:
2009
Page(s):
Keywords:
Abstract:
This paper investigates the relationship among the high frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (DC) behavior. The IR-Drop and the thermal performances are accurately investigated through 3D simulations. Measurements of the high frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis
Document:
Reference Id:
559
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