Title:
Plastic Packaged High Linearity Low Noise Amplifier for 12-30GHz Multi-band Telecom Applications
Author(s):
Estelle Byk, Pierre Quentin, Marc Camiade, Sylvie Tranchant
Source:
2006 IEEE MTT-S International Microwave Symposium Digest
Vol./Issue/Date:
2006
Year:
2006
Page(s):
1903-1906
Keywords:
MMICs , LNA, SMD, QFN, Package, OIP3
Abstract:
The packaged MMIC design and measured performance of a High Linearity and Low Noise Amplifier from 12 to 30GHz are reported in this paper. A mature 0.25µm gate length Low Noise Pseudomorphic HEMT technology has been used with a BCB-based protection allowing easy and high reliability chip integration into plastic packages. A standard plastic QFN SMD package has been successfully used : 25dB typical gain has been measured with less than 2.0 dB noise figure in all the frequency band from 12 to 30GHz and more than 26dBm Output IP3 has been measured in the 18-26GHz frequency band.
Document:
Reference Id:
338
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