Reference Details

Title:

SMT PAD USING A COAXIAL LINE STRUCTURE FOR LTCC SoP APPLICATIONS

Author(s):

Young Chul Lee

Source:

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS

Vol./Issue/Date:

Year:

2009

Page(s):

Keywords:

SMT, LTCC; transitions, coaxial line

Abstract:

In this work, a SMT (surface mount type) pad using a coaxial-line-like vertical via transition is presented for LTCC SoP (system-on-package) applications. Because the outer conductors of the coaxial-like transition overlaps with the CPW line on the PCB board, the overlap part is cut off to eliminate the their interaction or crosstalk. For reduction of radiation and return path, a cap on the top layer of the LTCC substrate is designed. The designed SMT pad was fabricated using the standard LTCC process. The measured S11 and S21 are 14 and 0.9 dB, respectively, at 15 GHz. © 2009 Wiley Periodicals, Inc. Microwave Opt Technol Lett 51: 1769–1772, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop. 24447

Document:

doi:10.1002/mop.24447

Reference Id:

526

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