Connectors

3D EM Modeling of a DDR4 Memory Channel

3D EM Modeling of a DDR4 Memory Channel
The modeling section of the webinar will look at the importance of return path discontinuities. When should we use a 2D approach and when do we need 3D full-wave solver? Can we adopt a "cascaded S-parameter” approach to modeling a channel, where each component is simulated separately, or must we revert to "combined 3D modeling", in which the full channel – controller package, motherboard and DIMM connector – are combined in a single 3D CAD model? Read full article..

High Speed and High Power Connector Design

High Speed and High Power Connector Design
As data transfer rates increase and complexity grows, designing high-speed connectors is becoming increasingly challenging, especially with multiple compliance regulations to meet. A precise analysis of the connector in isolation as well as the connector and PCB interface is essential, and can be only achieved by extensive use of 3D EM simulation during the development cycle. In this webinar we will present the benefits of CST STUDIO SUITE® 2013 for the simulation of high-speed connectors. Multiple examples, including display connectors and USB 3.0 connectors will be used to demonstrate features such as online TDR and cross-probing, with the aim of identifying impedance mismatches and discontinuities. A low-speed high-power connector analysis using multidisciplinary approaches (including electrical and thermal effects) will also be presented. Read full article..

New simulation workflows for predicting radiated emissions

New simulation workflows for predicting radiated emissions
In this video powerful new workflows for reliably predicting radiated emissions from electronics systems will be discussed. We start by importing a complex PCB model into CST PCB STUDIO and applying new EMC rules checking algorithms to rapidly identify potential weaknesses in the design. Critical nets, planes and vias are then analyzed to determine the differential mode (DM) to common mode (CM) conversion caused by driver skew and line imbalance. Finally, the resulting transient noise waveforms are injected into a 3D model of the connector/cable assembly and radiated emissions predicted. Important features of a typical anechoic chamber test are represented in the model using external ground plane reflections and cylindrical scanning to detect the peak emissions. Read full article..

Power Rating Simulation of the new QNS connector generation

Power Rating Simulation of the new QNS connector generation
IMS Connector Systems is an international, technology driven company specialized in development and production of high frequency connections. The product range includes a large assortment of coaxial RF connectors, coaxial cable assemblies, RF test switches, RF antenna switches, test adapters and test assemblies, battery contacts as well as antennas for mobile devices. Application and Simulation using CST MICROWAVE STUDIO® and CST EM STUDIO™ by Roland Baur, IMS Connector Systems, Löffingen, Germany Read full article..

3D EM Simulation in the Design Flow of High-Speed Multi-Pin Connectors

3D EM Simulation in the Design Flow of High-Speed Multi-Pin Connectors
This article describes the design flow for a high speed connector using different simulation tools. The goal is to enable a first pass design without time-intensive and costly iteration steps. In addition to other simulation tools, CST MICROWAVE STUDIO® (CST MWS) is used during different stages of the design process to find fundamental design parameters and to predict the behaviour of a complete telecommunication system. Read full article..

Long Range Connector Via Coupling Effects for High Speed Signals

Long Range Connector Via Coupling Effects for High Speed Signals Document type
Thomas-Michael Winkel, Roland Frech, IBM Entwicklungs GmbH Thomas Gneiting, AdMOS GmbH The interface between a multi pin connector and the printed circuit board is a critical part of the signal path in high speed digital systems like mainframe computers. Long range via coupling effects are analysed for connectors with a huge signal count and high speed signals using CST Microwave Studio simulations. A realistic cross section of the printed circuit board with a mixture of ground and voltage layers have been taken into account. It was possible to understand the reason for this behaviour by analyzing the field distributions during the signal propagation inside the printed circuit board. A further important result was the calculation of the magnitude of the distortions to judge their impact on the signal integrity of a complete system. Finally, the long range crosstalk effect was verified with time domain measurements on a specially designed test card system. Read full article..

Signal integrity analysis and circuit extraction of a mounted SMA connector

Signal integrity analysis and circuit extraction of a mounted SMA connector Document type
A physically based method is used for estimating the equivalent circuit model of an SMA connector soldered on the top plane of a multi-layer board and connected to a single-end stripline. Starting from the scattering parameters (S-parameters) evaluated using a simulation software package, the equivalent circuit is extracted by modeling each part of the structure. The circuit is then validated by comparing the outputs obtained via circuit-level simulation of the extracted physical circuit with those computed by means of the full wave solution. Read full article..

RJ45 Interconnect Signal Integrity

RJ45 Interconnect Signal Integrity
An RJ45 connector model, imported from Pro/E®, is simulated in CST MICROWAVE STUDIO®. The time domain waveforms are compared to TDR measurements. Model and results courtesy of North East Systems Associates (NESA). Read full article..

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