Application of Silicon Micromachining Techniques for the Manufacturing of New Passive THz-Components
Stephan Biber, Jan Sch¨ur, Lorenz-Peter Schmidt
German Microwave Conference - GeMiC 2006 -
1st January 0001
We present an overview on the application of silicon micromachining techniques to the fabrication of THz components. Different machining techniques will be discussed with respect to their capability to generate complex 3-dimensional geometries and to meet the high mechanical tolerance requirements for THz-components. In order to demonstrate the potential of the technology, results for the application of micromachining techniques to the design of new THz-components will be discussed. Two different components such as a quasi-optical filter at 2.5 THz and a horn antenna at 600 GHz will be discussed exemplarily. We will emphasize the potential of silicon based micro-structures for the manufacturing of new devices.
Back to References