Characterization of via holes discontinuities by means of numerical de-embedding
Antonini, G., Scogna, A.C., Orlandi, A.,
IEEE International Symposium on Electromagnetic Compatibility (EMC 2003)
Volume 2, 18-22 Aug.
591 - 596
A method for de-embedding scattering parameters S of a via hole in multilayer printed circuit board is presented. By assuming that the via hole is not electromagnetically coupled with the adjacent lines, the scattering parameters are evaluated starting from the calculation of the transfer scattering matrix T obtained by a three dimensional full
wave analysis of the test structure. The numerical approach used to obtain S and T parameters has been validated by comparison with results computed by other independent numerical methods and measurements. The proposed methodology allows a computational time saving and gives useful results for a CAD modeling of via hole
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