CST – Computer Simulation Technology

Experimental evaluation of differential chip-to-antenna bondwire interconnects above 110 GHz
Václav Valenta, Hermann Schumacher, Thomas Spreng, Volker Ziegler, Dragos Dancila, Anders Rydberg
Microwave Conference (EuMC), 2014 44th European
1st January 0001
pp 1008 - 1011
MMIC bondwire interconnect wire-bonding
Bondwire interconnects for differential chip-to-antenna interfaces are investigated. Two different compensation structures for different interconnect lengths are designed and evaluated using dedicated transmit and receive BiCMOS modules operating across a 110 to 156 GHz band. Measurement results demonstrate that a 9 GHz bandwidth and a minimum insertion loss of 0.2 dB can be achieved for interconnects as long as 0.8 mm, showing that the well established wire-bonding techniques are still an attractive solution even beyond 100 GHz. Reproducibility of the proposed solution is assessed as well.

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