CST – Computer Simulation Technology

Fully Embedded High Q Passives and Band Pass Filters for Low Cost Organic RF SOP (System on Package) Applications

Title:
Fully Embedded High Q Passives and Band Pass Filters for Low Cost Organic RF SOP (System on Package) Applications
Author(s):
Seung J. Lee, Hwan H. Lee, Jae Y. Park
Source:
Electronic Components and Technology Conference, 2007. ECTC '07. Proceedings. 57th
Vol./Issue/Date:
29 May - 1 June 2007
Year:
2006
Page(s):
2024 - 2029
Abstract:
In this paper, fully embedded high Q spiral inductors, MIM capacitor, 2.4GHz WLAN BPF and wide-band pass filter are investigated into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded passive components and filters were designed by using 3D EM simulators for finding out optimal geometries and verifying their applicability. An embedded circular spiral stacked inductor has inductance of 8.38nH and maximum quality factor of 73 at 1.5GHz, which is much higher than conventional film type chip ones. An embedded MIM capacitor has capacitance of 3.8pF and maximum quality factor of 39.2 at 950MHz. A fully embedded 2.4GHz WLAN BPF has a size of 2.7mm x 2.1mm x 0.77mm. It exhibits an insertion loss of -2.7dB and return loss of -12.5dB. WBPF is the first embedded and the smallest one of the filters formed onto the organic package substrate. It has a size of 3.2mm x 2.5mm x 0.77mm. It exhibits an insertion loss of -2.65dB, and an ultra-band width of 1.1GHz, and a center frequency of 2.1 GHz. The measured performance characteristics of the embedded passive components and filters are well matched with the simulated ones
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