IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications
Francesco de Paulis, Leo Raimondo, Antonio Orlandi
IEEE Transactions on Advanced Packaging
Volume: 33, Issue: 3, Aug. 2010
617 - 622
electromagnetic bandagap, IR-DROP, power integrity, thermal analysis
This paper investigates the relationship among the high frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (DC) behavior. The IR-Drop and the thermal performances are accurately investigated through 3D simulations. Measurements of the high frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis.
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