CST – Computer Simulation Technology

IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications
Francesco de Paulis, Leo Raimondo, Antonio Orlandi
IEEE Transactions on Advanced Packaging
Volume: 33, Issue: 3, Aug. 2010
617 - 622
electromagnetic bandagap, IR-DROP, power integrity, thermal analysis
This paper investigates the relationship among the high frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (DC) behavior. The IR-Drop and the thermal performances are accurately investigated through 3D simulations. Measurements of the high frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis.

Back to References

contact support

Your session has expired. Redirecting you to the login page...

We use cookie to operate this website, improve its usability, personalize your experience, and track visits. By continuing to use this site, you are consenting to use of cookies. You have the possibility to manage the parameters and choose whether to accept certain cookies while on the site. For more information, please read our updated privacy policy

Cookie Management

When you browse our website, cookies are enabled by default and data may be read or stored locally on your device. You can set your preferences below:

Functional cookies

These cookies enable additional functionality like saving preferences, allowing social interactions and analyzing usage for site optimization.

Advertising cookies

These cookies enable us and third parties to serve ads that are relevant to your interests.