CST – Computer Simulation Technology

Title:
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications
Author(s):
Francesco de Paulis, Leo Raimondo, Antonio Orlandi
Source:
IEEE Transactions on Advanced Packaging
Vol./Issue/Date:
Volume: 33, Issue: 3, Aug. 2010
Year:
2009
Page(s):
617 - 622
Keywords:
electromagnetic bandagap, IR-DROP, power integrity, thermal analysis
Abstract:
This paper investigates the relationship among the high frequency performances of a planar electromagnetic bandgap structure for power integrity applications and its static (DC) behavior. The IR-Drop and the thermal performances are accurately investigated through 3D simulations. Measurements of the high frequency electromagnetic properties and of the temperature variation are also performed for validating the models employed in the analysis.
Document:

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