CST – Computer Simulation Technology

Micromachined Thick Mesh Filters for Millimeter-Wave and Terahertz Applications

Micromachined Thick Mesh Filters for Millimeter-Wave and Terahertz Applications
Yi Wang, Bin Yang, Yingtao Tian, Robert S. Donnan, Michael J. Lancaster
IEEE Transactions on Terahertz Science and Technology
Volume: 4, Issue: 2, March 2014
247 - 253
Filters, frequency-selective surfaces (FSSs), micromachining, millimeter-wave (mm-wave) devices
This paper presents several freestanding bandpass mesh filters fabricated using an SU-8-based micromachining technique. The important geometric feature of the filters, which SU8 is able to increase, is the thickness of the cross-shaped micromachined slots. This is five times its width. This thickness offers an extra degree of control over the resonance characteristics. The large thickness not only strengthens the structures, but also enhances the resonance quality factor ( -factor). A 0.3-mm-thick, single-layer, mesh filter resonant at 300 GHz has been designed and fabricated and its performance verified. The measured -factor is 16.3 and the insertion loss is 0.98 dB. Two multi-layer filter structures have also been demonstrated. The first one is a stacked structure of two single mesh filters producing a double thickness, which achieved a further increased -factor of 27. This is over six times higher than a thin mesh filter. The second multilayer filter is an electromagnetically coupled structure forming a two-pole filter. The coupling characteristics are discussed based on experimental and simulation results. These thick mesh filters can potentially be used for sensing and material characterization at millimeter-wave and terahertz frequencies.

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