CST – Computer Simulation Technology

SMT PAD USING A COAXIAL LINE STRUCTURE FOR LTCC SoP APPLICATIONS

Title:
SMT PAD USING A COAXIAL LINE STRUCTURE FOR LTCC SoP APPLICATIONS
Author(s):
Young Chul Lee
Source:
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS
Vol./Issue/Date:
Volume: 51, Issue: 7, July 2009
Year:
2009
Page(s):
1769–1772
Keywords:
SMT, LTCC, transitions, coaxial line
Abstract:
In this work, a SMT (surface mount type) pad using a coaxial-line-like vertical via transition is presented for LTCC SoP (system-on-package) applications. Because the outer conductors of the coaxial-like transition overlaps with the CPW line on the PCB board, the overlap part is cut off to eliminate the their interaction or crosstalk. For reduction of radiation and return path, a cap on the top layer of the LTCC substrate is designed. The designed SMT pad was fabricated using the standard LTCC process. The measured S11 and S21 are 14 and 0.9 dB, respectively, at 15 GHz. © 2009 Wiley Periodicals, Inc. Microwave Opt Technol Lett 51: 1769–1772, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop. 24447
Document:

Back to References

contact support

Your session has expired. Redirecting you to the login page...