SPICE Model Libraries for Via Transitions
Shaofeng Luan, Giuseppe Selli, Jun Fan, Mauro Lai, James L. Knighten
Electromagnetic Compatibility, 2003 IEEE International Symposium on
Volume 2, 18-22 Aug.
859 - 864
PCB, multilayer PCB, CEMPIE, PEEC, SPICE, via transition
A procedure of building SPICE models for signal via transitions between printed circuit board layers is presented in this paper. The method of extracting parameters of SPICE models from full-wave simulation
tool is demonstrated. Then the validity of SPICE models is studied by comparing the solution from SPICE model with that from the full-wave simulation.
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