CST – Computer Simulation Technology

Title:
SPICE Model Libraries for Via Transitions
Author(s):
Shaofeng Luan, Giuseppe Selli, Jun Fan, Mauro Lai, James L. Knighten
Source:
Electromagnetic Compatibility, 2003 IEEE International Symposium on
Vol./Issue/Date:
Volume 2, 18-22 Aug.
Year:
2003
Page(s):
859 - 864
Keywords:
PCB, multilayer PCB, CEMPIE, PEEC, SPICE, via transition
Abstract:
A procedure of building SPICE models for signal via transitions between printed circuit board layers is presented in this paper. The method of extracting parameters of SPICE models from full-wave simulation tool is demonstrated. Then the validity of SPICE models is studied by comparing the solution from SPICE model with that from the full-wave simulation.
Document:

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