CST welcomed over 40 Signal- and Power-Integrity engineers to the "EDA goes 3D" workshop held on June the 27th in Santa Clara, California.
During this event, applications such as multilayer printed circuit boards (PCBs), IC packaging, LTCC transitions were examined, and the application of 3D EM simulation discussed.
"We are pleased with the resonance of this workshop. It clearly shows the demand for 3D simulation in this industry and the acceptance of CST’s solutions," commented one of the organizers Dr. Antonio Ciccomancini Scogna. This workshop was the second in its series.