With the latest release of CST MWS 2006, engineers interested in SI issues can now import multi-layer structures, including vias, previously laid-out in tools from Cadence, Mentor, Zuken via the new GERBER interface.
Automation & Electronics 2019
June 5-6, 2019
Getting Ahead with High-Speed Digital Simulation and Measurement
Simulation can dramatically reduce the design cycles for high-speed digital engineers, removing the need to wait for an expensive and time consuming prototype cycle. In this webinar we will give a practical guide on how set up this kind of simulation...
Antenna Magus: the Leading Antenna Design Tool
Getting Ahead with RF Breakdown Simulation for Space Hardware
In this eSeminar we will review the RF Breakdown effects which can occur in space hardware, namely multipactor discharge. The eSeminar will focus on the advantages of using full numerical approaches instead of analytical ones to determine the breakdown...
Series fed 3 by 3 rectangular patch
The array consists of a 3 x 3 series fed configuration of rectangular patches. By adjusting the excitation of these ports, the direction of the main beam (squint) as well as the sense of linear...
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