Cadence and CST offer very effective solutions for high speed PCB/package co-design. Two different workflows will be presented: 1) the “EDA centric” approach that allows the full wave simulation to be run as a fully background process with back annotation of the results to the layout environment and 2) the “EM centric approach” that focuses on the full wave environment. The benefits of such level of integration in the daily work of design engineers will be discussed.
For more information contact CST or call +49-6151-7303-0.
This article presents the power integrity workflow using CST PCB STUDIO® for a high speed board. Power integrity analysis is performed in both DC and AC. Optimizing the PDN impedance in the frequency domain is one of the major goals in order to minimize...
3D Full Wave Cross-Talk Simulation of Multilayer PCB
The increased complexity of multilayer PCBs makes signal integrity studies with accurate 3D EM field simulators indispensable in order to optimize EMC performance. CST MICROWAVE STUDIO® is used to simulate a multilayered PCB, producing a good correlation...
Signal Integrity (SI) analysis
This article highlights the modeling and simulation of signal integrity effects with CST PCB STUDIO® (CST PCBS). It explains how the technology (layer stackup) can be determined and which modeling options are available. Since SI investigations require...
Co-Simulation of a MMIC Low Noise Amplifier and a 3D via Hole Structure
CST DESIGN STUDIO™ has been used for a simultaneous optimisation of circuit elements with the built-in circuit simulator and the inductance of a 3D via hole model with CST MICROWAVE STUDIO®. For more complex layouts CST MWS 3D models can be used in Agilent...
3D EM simulation of mixed analog/digital multilayer PCB
This article describes the use of CST MICROWAVE STUDIO® (CST MWS) to solve a coupling problem in a mixed analog – digital multilayer PCB card.
Courtesy and permission of Alvarion, Ltd, Tel-Aviv, Israel.
This example gives an insight into the usefulness...
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