The drive for higher performance leads to increasing complexity and miniaturization of electronic circuit on-chip, more functionality on package level and high density PCB boards. PCB/Package designers are therefore taking the electrical environment via Co-Design and Co-Optimization into account. This webinar addresses the challenges in modeling and simulation for PCB package Co-Design and Co-Optimization.
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This article presents the power integrity workflow using CST PCB STUDIO® for a high speed board. Power integrity analysis is performed in both DC and AC. Optimizing the PDN impedance in the frequency domain is one of the major goals in order to minimize...
3D Full Wave Cross-Talk Simulation of Multilayer PCB
The increased complexity of multilayer PCBs makes signal integrity studies with accurate 3D EM field simulators indispensable in order to optimize EMC performance. CST MICROWAVE STUDIO® is used to simulate a multilayered PCB, producing a good correlation...
Signal Integrity (SI) analysis
This article highlights the modeling and simulation of signal integrity effects with CST PCB STUDIO® (CST PCBS). It explains how the technology (layer stackup) can be determined and which modeling options are available. Since SI investigations require...
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