CST – Computer Simulation Technology

PCB and Package Co-Design and Co-Optimization

Recording date: December 1, 2011

60 min

English

 

The drive for higher performance leads to increasing complexity and miniaturization of electronic circuit on-chip, more functionality on package level and high density PCB boards. PCB/Package designers are therefore taking the electrical environment via Co-Design and Co-Optimization into account. This webinar addresses the challenges in modeling and simulation for PCB package Co-Design and Co-Optimization.

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