The drive toward increased integration densities of electronic devices has led to smaller transmission line conductor sizes and structures consisting of multiple lossy dielectrics. At the same time, higher bit-rates of 100 GBits/s, has led to increased loss due to skin-effects. Losses in these types of transmission lines are often difficult to predict due to non-ideal transmission line cross-sections, including surface roughness and edge-shape effects. To develop realistic simulated insertion loss, all insertion loss components need to be considered and accounted for. Dielectric and conductor loss components require careful material parameterization and structure set up. An overview of these parameterizations and set up will be given, including the trace cross-section shape influence on conductor loss, an often overlooked phenomenon. Options for including surface roughness contribution to conductor loss, for both full wave 3D and analytical models, will be explored.
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This article presents the power integrity workflow using CST PCB STUDIO® for a high speed board. Power integrity analysis is performed in both DC and AC. Optimizing the PDN impedance in the frequency domain is one of the major goals in order to minimize...
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