CST – Computer Simulation Technology

EMC Simulation of Automotive Ethernet

EMC Live 2018

Recording date: April 26, 2018

60 min

English

 

The demand for high speed data transmission between electronics systems in modern vehicles has experienced a dramatic increase over the past years. The current generation of infotainment and ADAS systems already requires high data rates that are projected to grow even further in the future, fueled by trends like the upcoming introduction of connected and autonomous vehicles.

Automotive ethernet based on the BroadR-Reach technology is a promising candidate to become the standard high speed interface in vehicles. The current implementation offers a data rate of 100 Mbit/s over a single unshielded twisted pair cable, with plans to further increase it to 1000 Mbit/s. Unshielded twisted cables are lightweight and cost effective, however this comes at the cost of reduced EMC performance. The high data rates and the cable layout can pose significant challenges on designers of automotive electronics.

This webinar will present simulations of EMC related aspects of the automotive ethernet: the effect of the PCB layout on the emission from an automotive ethernet channel, crosstalk from the automotive ethernet channel to other cables inside one harness, and susceptibility of the channel based on the BCI testing method.

Presenter

Patrick DeRoy

Patrick DeRoy completed his B.S. and M.S. degrees in Electrical and Computer Engineering from UMASS Amherst in 2012. His coursework focused primarily on microwave engineering, but he now focuses on the field of Electromagnetic Compatibility. He completed his Master’s with CST, investigating cable shielding and transfer impedance modeling, correlating simulation and measurement results. He is an Application Engineer, primarily supporting customers modeling EMC problems ranging from emissions on power electronics PCBs, to larger scale problems such as lightning strike. A growing area of interest and increasing focus is simulation of Signal and Power Integrity at the IC package and PCB level, as well as interference between RF and high speed digital systems.

Materials:

1. EMC Simulation for Automotive Ethernet

Watch the Recording

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