Recording date: October 4, 2018
The use of highly-integrated photonic circuits (PICs) is on the rise, and this trend is expected to accelerate in the future.
The design of these complex circuits involves multiple steps, starting at the component level and continuing up to the circuit level. Due to this hierarchical structure, small variations at the component level resulting from fabrication tolerances can have a significant influence on the overall circuit performance.
This eSeminar focuses on two software packages, which combine advanced simulation of passive photonic, active optoelectronic and hybrid photonic integrated circuits and systems with highly accurate full-wave 3D photonic and multiphysics simulation.
We will demonstrate how using VPIphotonics Design Suite™ and CST Studio Suite® together enables engineers designing PICs to automate combined circuit level and full wave simulation. This allows the study of the effect of small variations in the components on the overall circuit, meaning that the engineer can increase yield and reliability by making the circuit resilient to such effects.
Frank Scharf is the Technical Sales Director for SIMULIA, Dassault Systemes brand with a focus on optical applications. Scharf obtained his Ph.D. in Electrical Engineering from Ruhr-Universitaet Bochum, Germany. During his graduate studies, he focused on modeling and simulating the plasma sheath in high intensity discharge lamps. Frank joined CST Germany in 2008 and transferred to CST of America in 2009.
Eugene Sokolov is a Senior Application Engineer at VPIphotonics. He has over 8 years experience in the development of market leading PDA products and particularly in the modeling of the modern and next generation photonic integrated circuits (PICs), photonic and optoelectronic devices. Eugene joined VPIphotonics in 2010 and he currently works in VPIphotonics Inc., which is located in Norwood, Massachusetts, United States.
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