Recording date: February 16, 2017
Michelangelo Bandinu received his degree in Electronic Engineering from Politecnico di Torino, Italy in January 2005. In 2005, he worked as an Application Engineer at IBM Deutschland Entwicklung GmbH, Boeblingen (Germany) within the IBM Packaging Development group. From 2006 to 2010, he was at Politecnico di Torino where he carried out research projects on modeling and simulation of interconnect structures. In 2007, he co-founded IdemWorks s.r.l. serving as CEO and Product Manager of the IdEM product. He is currently Managing Director of IdemWorks, a CST Company and now part of Dassault Systèmes.
The complexity of modern high-end electronic systems as well as strict time-to-market constraints require fast and reliable Signal/Power Integrity and Electromagnetic Compatibility performance assessments from very preliminary stages of the design onwards. Such assessments are usually performed via numerical simulations aimed at the prediction of the signals propagating on the system interconnects. This type of analysis is enabled by the availability of accurate and efficient models for all relevant passive system components including, e.g., interconnects, vias, connectors, packages, discontinuities, up to backplane links and complete power delivery networks. This webinar will show how the state-of-the-art macromodeling software IdEM provides the ideal tool to verify the physical self-consistency of S-parameter data, and to generate stable, passive and causal broadband computational models and/or equivalent circuits that can be safely used in any SPICE-based simulation environment for reliable Signal and Power Integrity assessment.