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CST MICROWAVE STUDIO®

Technical Specification

1 May 2016

Frontend Module
  • For functionality and CAD/EDA import filter, see technical specifications of the CST STUDIO SUITE®

Transient Solver 

  • Fast and memory efficient Finite Integration Technique (FIT)
  • Efficient calculation for loss-free and lossy structures
  • Direct time‐domain analysis and broadband calculation of S-parameters from one single calculation run by applying DFTs to time signals
  • Calculation of field distributions as a function of time or at multiple selected frequencies from one simulation run
  • Adaptive mesh refinement in 3D using S-Parameter or 0D results as stop criteria
  • Shared memory parallelization of the transient solver run and of the matrix calculator
  • MPI Cluster parallelization via domain decomposition
  • Support of hardware acceleration (NVIDIA GPU or Intel® Xeon Phi™) with up to eight acceleration cards
  • Combined simulation with MPI and hardware acceleration
  • Support of Linux batch mode and batch queuing systems (e.g. OGE, LSF)
  • Support of more than 2 billion mesh cells (with MPI)
  • Isotropic and anisotropic material properties
  • Frequency dependent material properties with arbitrary order for permittivity and permeability as well as a material parameter fitting functionality
  • Gyrotropic materials (magnetized ferrites) as well as field-dependent microwave plasma
  • Non-linear material models (Kerr, Raman)
  • Spatially varying material models (general or with specialized radial dependency)
  • Surface impedance models (tabulated surface impedance, Ohmic sheet, lossy metal, corrugated wall, material coating, metal surface roughness)
  • Frequency dependent thin panel materials defined based on a multilayered stackup or an S-Matrix table (isotropic and symmetric)
  • Special perforation materials like wire mesh and air ventilation panels (isotropic)
  • Time dependent conductive materials (volumetric or lossy metal type)
  • Temperature dependent materials with coupling to CST MPHYSICS® STUDIO
  • Port mode calculation by a 2D eigenmode solver in the frequency domain
  • Selective calculation of higher order port modes
  • Automatic waveguide port mesh adaptation
  • Multipin and single-ended ports for (Q)TEM mode ports with multiple conductors
  • Broadband treatment of inhomogeneous ports
  • Multiport and multimode excitation (sequentially or simultaneously)
  • PEC or PMC shielding functionality for waveguide ports
  • Plane wave excitation (linear and broadband circular or elliptical polarization)
  • Excitation by external nearfield sources imported from CST MICROWAVE STUDIO or Sigrity®
  • Excitation by a current distribution imported from CST CABLE STUDIO®
  • Online TDR analysis with Gaussian or rectangular shape excitation function
  • User defined excitation signals and signal database
  • Simultaneous port excitation with different excitation signals for each port and broadband phase shift
  • Single port excitation with user definable amplitude and phase setting
  • Transient EM/circuit co-simulation with CST DESIGN STUDIO™ network elements
  • AC radiation or irradiation co-simulation with CST CABLE STUDIO
  • Transient radiation, irradiation or bi-directional co-simulation with CST CABLE STUDIO
  • S-parameter symmetry option to decrease solve time for many structures
  • Auto-regressive filtering for efficient treatment of strongly resonating structures
  • Re-normalization of S-parameters for specified port impedances
  • Phase de-embedding of S-parameters
  • Inhomogeneous port accuracy enhancement for highly accurate S-parameter results, considering also low loss dielectrics
  • Single-ended S-parameter calculation
  • S-parameter sensitivity and yield analysis
  • Combined linear and logarithmic sampling of 1D spectral results
  • High performance radiating/absorbing boundary conditions
  • Conducting wall boundary conditions
  • Periodic boundary conditions without phase shift
  • Calculation of various electromagnetic quantities such as electric fields, magnetic fields, surface currents, power flows, current densities, power loss densities, electric energy densities, magnetic energy densities, voltages or currents in time and frequency domain
  • 1D power loss results (time and frequency domain) per material or solid
  • Calculation of time averaged power loss volume monitors
  • Antenna farfield calculation (including gain, beam direction, side lobe suppression, etc.) with and without farfield approximation at multiple selected frequencies
  • Broadband farfield monitors and farfield probes to determine broadband farfield information over a wide angular range or at certain angles
  • Antenna array farfield calculation
  • Radar Cross Section (RCS) calculation
  • Calculation of Specific Absorption Rate (SAR) distributions
  • Export of field source monitors, which then may be used as excitation for other  CST MICROWAVE STUDIO solvers
  • Discrete edge and face elements (lumped resistors) as ports
  • Ideal voltage and current sources for EMC problems
  • Discrete edge and face R, L, C, and (nonlinear) diode elements at any location in the structure
  • Automatic parameter studies using built-in parameter sweep tool
  • Automatic structure optimization for arbitrary goals using built-in optimizer
  • Network distributed computing for optimizations, parameter sweeps and multiple port/mode excitations
  • Coupled simulations with the Thermal Solver from CST MPHYSICS® STUDIO

TLM Solver 

  • Time domain Transmission‐Line Matrix (TLM) method with octree-based meshing
  • Efficient calculation for loss-free and lossy structures
  • Direct time‐domain analysis and broadband calculation of S-parameters from one single calculation run by applying DFTs to time signals
  • Applicable to EMC/EMI applications such as radiated and conducted emissions and immunity, EMP and lightning, electrostatic discharge (ESD), high speed interference and shielding analysis
  • Support of GPU acceleration
  • Isotropic and anisotropic material properties
  • Frequency dependent material properties with arbitrary order for permittivity and permeability as well as a material parameter fitting functionality
  • Frequency dependent thin panel materials defined based on a multilayered stackup or an S-Matrix table
  • Special perforation materials like wire mesh and air ventilation panels
  • User defined excitation signals and signal database
  • Simultaneous port excitation with different excitation signals for each port and broadband phase shift
  • Transient EM/circuit co-simulation with CST DESIGN STUDIO™ network elements
  • AC radiation or irradiation co-simulation with CST CABLE STUDIO® 
  • Transient radiation, irradiation or bi-directional co-simulation with CST CABLE STUDIO
  • Compact models which avoid excessively fine meshes for:
    • slots, seams and gaskets
    • multi‐conductor wires
    • shielded cables
    • frequency dependent thin panels
    • conductive coatings and absorbers
  • Broadband compact antenna radiation sources based on the Equivalence Principle
  • Calculation of various electromagnetic quantities such as electric fields, magnetic fields, surface currents, power flows, current densities, power loss densities, electric energy densities, magnetic energy densities, voltages or currents in time and frequency domain
  • Antenna farfield calculation (including gain, beam direction, etc.)
  • Cylinder scan for emissions analysis yielding peak radiated fields vs. frequency
  • Simulation of coupling into shielded cables for transient protection analysis
  • Discrete edge or face elements (lumped resistors) as ports
  • Ideal voltage and current sources for EMC problems
  • Lumped R, L, C elements at any location in the structure

Frequency Domain Solver 

  • Efficient calculation for loss-free and lossy structures
  • Support of hexahedral meshes as well as linear and curved tetrahedral meshes
  • Adaptive mesh refinement in 3D using S-parameters at multiple frequency points, broadband S-parameters, as well as 0D and 1D result templates as stopping criteria
  • Special mesh refinement for singular edges
  • True Geometry Adaptation
  • Option to maintain the tetrahedral mesh during optimization and parameter sweep with small geometric changes
  • Fast broadband adaptive frequency sweep for S-parameters
  • Equidistant, logarithmic and user defined frequency sweeps and evaluation for 1D results
  • Continuation of the solver run with additional frequency samples
  • Low frequency stabilization
  • Direct and iterative matrix solvers with convergence acceleration techniques
  • Higher order representation of the fields, with either constant or variable order (with tetrahedral mesh)
  • Support of Linux batch mode and batch queuing systems (e.g. OGE, LSF)
  • Isotropic and anisotropic material properties
  • Arbitrary frequency dependent material properties (general purpose sweep with tetrahedral mesh)
  • Surface impedance model for good conductors, Ohmic sheets and corrugated walls, as well as frequency-dependent, tabulated surface impedance data and coated materials (with tetrahedral mesh)
  • Inhomogeneously biased ferrites with a static biasing field (general purpose sweep with tetrahedral mesh)
  • Port mode calculation by a 2D eigenmode solver in the frequency domain
  • Automatic waveguide port mesh adaptation (with tetrahedral mesh)
  • Multipin ports for TEM modes in ports with multiple conductors
  • PEC or PMC shielding functionality for waveguide ports
  • Plane wave excitation with linear, circular or elliptical polarization, as well as plane waves in layered dielectrics (general purpose sweep with tetrahedral mesh)
  • Discrete edge and face elements (lumped resistors) as ports (face elements: with tetrahedral mesh)
  • Ideal current source for EMC problems (general purpose sweep with tetrahedral mesh)
  • Nearfield source imprint on open boundaries, lossy metal, and Ohmic sheets (general purpose sweep with tetrahedral mesh)
  • Lumped R, L, C elements at any location in the structure
  • Re-normalization of S-parameters for specified port impedances
  • Phase de-embedding of S-parameters
  • Single-ended S-parameter calculation, with native single-ended field monitors for tetrahedral mesh
  • S-parameter sensitivity and yield analysis (with tetrahedral mesh)
  • High performance radiating/absorbing boundary conditions
  • Conducting wall boundary conditions (with tetrahedral mesh)
  • Periodic boundary conditions including phase shift or scan angle
  • Unit cell feature to simplify the simulation of periodic antenna arrays or of frequency selective surfaces (general purpose sweep)
  • Convenient generation of the unit cell calculation domain from arbitrary structures (with tetrahedral mesh)
  • Floquet mode ports (periodic waveguide ports)
  • Fast farfield calculation based on the Floquet port aperture fields (general purpose sweep with tetrahedral mesh)
  • Calculation of various electromagnetic quantities such as electric fields, magnetic fields, surface currents, power flows, current densities, surface and volumetric power loss densities, electric energy densities, magnetic energy densities
  • Antenna farfield and farfield probe calculation (including gain, beam direction, side lobe suppression, etc.) with and without farfield approximation
  • Antenna array farfield calculation
  • RCS calculation (with tetrahedral mesh)
  • Calculation of SAR distributions (with hexahedral mesh)
  • Export of field source monitors (with tetrahedral mesh), which then may be used as excitation for other  CST MICROWAVE STUDIO solvers
  • Export of fields for corona discharge and multipactor analysis with Spark3D (general purpose sweep with tetrahedral mesh only)
  • Automatic parameter studies using built-in parameter sweep tool
  • Automatic structure optimization for arbitrary goals using built-in optimizer
  • Network distributed computing for optimizations and parameter sweeps
  • Network distributed computing for frequency samples and remote calculation
  • Coupled simulations with the Thermal Solver and the Stress Solver from CST MPHYSICS STUDIO
  • Besides the general purpose frequency sweep, a fast reduced order model technique, specifically designed for the efficient calculation of broadband results such as S-parameters, field probes and far-field probes, is available.

Integral Equation Solver 

  • Calculation of various electromagnetic quantities such as electric fields, magnetic fields, surface currents
  • Antenna farfield calculation (including gain, beam direction, side lobe suppression, etc.)
  • RCS calculation
  • Fast monostatic RCS sweep
  • Characteristic Mode Analysis
  • Waveguide port excitation
  • Plane wave excitation
  • Nearfield excitation
  • Farfield excitation
  • Farfield excitation with multipole coefficient calculation
  • Receiving farfield excitation
  • Current distribution
  • Discrete edge and face port excitation
  • Face lumped R, L, C elements
  • Symmetries are supported for discrete ports, waveguide ports, plane wave and farfield excitations.
  • MPI parallelization for MLFMM and direct solver
  • Support of GPU acceleration for MLFMM direct solver
  • Support of combined MPI & GPU acceleration for MLFMM
  • Support of Linux batch mode and batch queuing systems (e.g. OGE, LSF)
  • Infinite electric and magnetic ground planes
  • Infinite Real Ground option
  • Multithread parallelization
  • Efficient calculation of loss-free and lossy structures including lossy waveguide ports
  • Surface mesh discretization (triangles and quadrilaterals)
  • Wire mesh discretization
  • Support of Curved Mesh (quadrilateral and triangular surface mesh elements)
  • Handling of layered media which enables simulation of windshield antennas etc.
  • Isotropic material properties
  • Coated materials
  • Arbitrary frequency dependent material properties
  • Automatic fast broadband adaptive frequency sweep
  • User defined frequency sweeps
  • Low frequency stabilization
  • Direct and iterative matrix solvers with convergence acceleration techniques
  • Higher order representation of the fields including mixed order
  • Single and double precision floating-point representation
  • Port mode calculation by a 2D eigenmode solver in the frequency domain
  • Re-normalization of S-parameters for specified port impedances
  • Phase de-embedding of S-parameters
  • Automatic parameter studies using built-in parameter sweep tool
  • Automatic structure optimization for arbitrary goals using built-in optimizer
  • Network distributed computing for optimizations and parameter sweeps
  • Network distributed computing for frequency sweeps

Multilayer Solver 

  • Calculation of S-parameters and surface currents
  • Waveguide (multipin) port excitation
  • Discrete face port excitation
  • Characteristic Mode Analysis
  • Face lumped R, L, C elements
  • Multithread parallelization
  • MPI parallelization for the direct solver
  • Efficient calculation of loss-free and lossy structures
  • Surface mesh discretization (curved triangles and quadrilaterals)
  • Support of Curved Mesh (quadrilateral and triangular surface mesh elements)
  • Automatic edge mesh refinement is available for finite-thickness and infinitely thin conductors
  • Isotropic material properties
  • Arbitrary frequency dependent material properties
  • Automatic fast broadband adaptive frequency sweep
  • User defined frequency sweeps
  • Re-normalization of S-parameters for specified port impedances
  • Phase de-embedding of S-parameters
  • Automatic parameter studies using built-in parameter sweep tool
  • Automatic structure optimization for arbitrary goals using built-in optimizer
  • Network distributed computing for optimizations and parameter sweeps
  • Network distributed computing for frequency sweeps

Asymptotic Solver 

  • Specialized tool for fast monostatic and bistatic RCS sweeps and antenna farfield calculations
  • Calculation of electric and magnetic fields (as field probes)
  • Multiple plane wave excitations with different polarization types
  • Farfield and nearfield source excitations
  • Robust surface mesh discretization including curved meshes
  • PEC and vacuum material properties
  • Complex surface impedance materials
  • Coated materials (incl. frequency dependent and angle dependent properties)
  • Thin dielectrics (incl. frequency dependent and angle dependent properties)
  • User defined frequency sweeps and angular sweeps
  • Fast ray tracing technique including multiple reflections and edge diffraction (SBR) by using either independent rays or ray-tubes
  • Visualization of rays including multiple reflections
  • Visualization of points where the rays initially hit the structure
  • Computation of range profiles and sinograms
  • Computation of scattering hotspots
  • Computation of RCS maps
  • Tabulated export of raw solver data
  • Multithread parallelization
  • Support of GPU acceleration for field sources and bistatic calculations
  • Automatic parameter studies using built-in parameter sweep tool
  • Automatic structure optimization for arbitrary goals using built-in optimizer
  • Network distributed computing for optimizations and parameter sweeps
  • Network distributed computing for excitation angles

Eigenmode Solver 

  • Calculation of modal field distributions in closed loss-free or lossy structures
  • Support of hexahedral meshes as well as linear and curved tetrahedral meshes
  • Isotropic and anisotropic materials
  • Multithread parallelization
  • Adaptive mesh refinement in 3D, with True Geometry Adaptation
  • Periodic boundary conditions including phase shift
  • Calculation of losses and internal / external Q-factors for each mode (directly or  using perturbation method)
  • Discrete L,C elements at any location in the structure
  • Target frequency can be set (calculation within the frequency interval)
  • Calculation of all eigenmodes in a given frequency interval
  • Sensitivity analysis with respect to materials and geometric deformations defined by face constraints (with tetrahedral mesh)
  • Automatic parameter studies using built-in parameter sweep tool
  • Automatic structure optimization for arbitrary goals using built-in optimizer
  • Network distributed computing for optimizations and parameter sweeps
  • Export of fields for corona discharge and multipactor analysis with Spark3D
  • Coupled simulations with the Thermal Solver and the Stress Solver from CST MPHYSICS STUDIO

Automation

  • Fully parametric 3D modelling
  • VBA macro language
  • OLE automation server
  • Automatic parameter studies using built-in parameter sweep tool
  • Template based postprocessing
  • Automatic structure optimization for arbitrary goals using built-in optimizer
  • Built-in wizard for phased array design and field source simulations
CST Simulation Acceleration
  • Acceleration options handled by a token scheme
Documentation
  • See technical specifications of the CST STUDIO SUITE
Minimum Hardware Requirements
  • Intel® Xeon® based PC, 4 GB RAM (8 GB recommended), DVD drive, at least 30 GB of free hard disc space (60 GB recommended).
  • Fully OpenGL compliant graphics card
  • Windows 7, Windows 2008 Server R2, Windows 8, Windows 2012 Server, Windows 8.1, Windows 2012 Server R2 and Windows 10
  • All solvers (except TLM and Multilayer) support RedHat Enterprise Linux (RHEL) 5.x, 6.x and 7.x and SUSE Enterprise Linux 11.x. Some features may not be available, however.
  • Hardware recommendation depends on your application. If in doubt, please contact your local sales office for further information. For further details, please see our hardware recommendations.
General
  • CST MICROWAVE STUDIO® is a configurable tool with a choice of several solver modules. Not all listed options are included in the standard license. Not all listed features are available with all solvers. The standard configuration is one full solver process with one solver module and one additional frontend. Floating and node-locked licenses are available. Please contact your local sales office for further information.

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