Signal Integrity of Cadence Allegro Backplane Trace Import
A portion of a backplane, designed with the Cadence Allegro® layout tool, is imported into CST MICROWAVE STUDIO®. This section consists of a differential pair with vias which go through the board. The structure was analyzed in Microwave Studio. The...
Signal Integrity of High Speed Flip Chip Package
This article describes how CST MICROWAVE STUDIO® is used to analyze the signal integrity of a flip chip package. The study is to determine the effect of ground planes on insertion loss of the package signals.
Full Package Signal Integrity Analysis
This article presents the use of CST MICROWAVE STUDIO® (CST MWS) for the simulation of large IC packages. From the time domain simulation network parameters can be extracted and further processed in CST DESIGN STUDIO™.
Electrical Performance of High Speed Signaling in Coupled Microstrip Lines
The electrical performance of high speed signaling in coupled differential microstrip lines is analyzed. Based on the modal decomposition analysis, the cancellation frequency in the single-ended insertion loss response is explained and a closed formula...
ERNI ERmet zeroXT High Speed SMT Connector
The ERNI Ermet zeroXT connector is able to transmit differential signals up to a data rate of 10Gbit/s [of a non-return zero code]. The complete design support, including the electromagnetic field analysis, the impedance calculation and the crosstalk...