This article presents the use of CST MICROWAVE STUDIO® (CST MWS) for the simulation of large IC packages. Network parameters can be extracted from the time domain simulation and further processed in CST DESIGN STUDIO™.
Flip Chip Package Pre-Layout Study
This article describes how CST MICROWAVE STUDIO® is used to analyze the signal integrity of a flip chip package. The impact of having multiple ground planes in the package is clearly seen by the improvements to the insertion loss.
Power Integrity Simulation for High Speed Board
This article presents the power integrity workflow using CST PCB STUDIO® for a high speed board. Power integrity analysis is performed in both DC and AC. Optimizing the PDN impedance in the frequency domain is one of the major goals in order to minimize...
Electrical Performance of High Speed Signaling in Coupled Microstrip Lines
The electrical performance of high speed signaling in coupled differential microstrip lines is analyzed. Based on the modal decomposition analysis, the cancellation frequency in the single-ended insertion loss response is explained and a closed formula...
Thermal Modeling of Heat Sinks
Heat sinks serve to transfer the generated heat of an electronic system away from the active and passive electronic components and toward the ambient environment. This article shows how temperature distributions and heat flows can be efficiently simulated...
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