CST – Computer Simulation Technology

Design and Optimization of Electronic Package Designs

 

Accurate analysis of complex electronic package signal and power integrity requires striking a balance between accuracy, in order to capture the necessary physics, and simplification, to reduce simulation time and compute requirements to manageable levels.

With this eSeminar, learn about:

  • Packaging design flow: pre-layout and post-layout
  • Signal integrity (SI) and Power integrity (PI) analysis
  • Package SIPI co-extraction methodology

 

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