As data transfer rates increase and complexity grows, designing high-speed connectors is becoming increasingly challenging, especially with multiple compliance regulations to meet. A precise analysis of the connector in isolation as well as the connector and PCB interface is essential, and can be only achieved by extensive use of 3D EM simulation during the development cycle.
In this eSeminar we will present the benefits of CST Studio Suite® for the simulation of high-speed connectors. Multiple examples, including display connectors and USB 3.0 connectors, will be used to demonstrate features such as online TDR and cross-probing, with the aim of identifying impedance mismatches and discontinuities. A low-speed high-power connector analysis using multidisciplinary approaches (including electrical and thermal effects) will also be presented.