Stripline models can be used to determine the impact of copper surface roughness on transmission properties.
In high speed digital interconnects, signal attenuation is a result of both dielectric losses and conductor losses. Many articles have shown in detail the characterization and modeling efforts related to the impact of dielectric loss in PCBs and the differences between various dielectric materials. Nevertheless, high-speed characterization modeling efforts do not often take into account the variations in conductor losses due to copper foil roughness or treatments made to the copper foil to promote adhesion.
This article presents the power integrity workflow using CST PCB STUDIO® for a high speed board. Power integrity analysis is performed in both DC and AC. Optimizing the PDN impedance in the frequency domain is one of the major goals in order to minimize...
RJ45 Interconnect Signal Integrity
An RJ45 connector model imported from Pro/E® is simulated in CST MICROWAVE STUDIO®. The time domain waveforms show good correlation to the TDR measurements. Model and results courtesy of North East Systems Associates (NESA).
Flip Chip Package Pre-Layout Study
This article describes how CST MICROWAVE STUDIO® is used to analyze the signal integrity of a flip chip package. The impact of having multiple ground planes in the package is clearly seen by the improvements to the insertion loss.
Signal Integrity (SI) analysis
This article highlights the modeling and simulation of signal integrity effects with CST PCB STUDIO® (CST PCBS). It explains how the technology (layer stackup) can be determined and which modeling options are available. Since SI investigations require...
3D Full Wave Cross-Talk Simulation of Multilayer PCB
The increased complexity of multilayer PCBs makes signal integrity studies with accurate 3D EM field simulators indispensable in order to optimize EMC performance. CST MICROWAVE STUDIO® is used to simulate a multilayered PCB, producing a good correlation...
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