Print Circuit Boards (PCBs) are at the heart of most modern electronics. However, ever increasing demands for more versatile functions, higher speeds and smaller footprints pose significant challenges to the design of the PCB. Moreover, placing a well-designed PCB in an actual operating environment could still lead to unexpected electromagnetic compatibility (EMC) and thermal issues, which requires costly redesign or retrofitting.
This eSeminar focuses on a holistic simulation approach that analyzes signal and power integrity (SI/PI), EMC and thermal aspects of PCB design. This allows designers to identify potential issues early in the design stage, optimize the design, virtually test various operational environments and ensure the PCB’s functionality and reliability.