Cables not only transfer the power needed to run electrical equipment,
but also the data signals needed to operate them. To prevent errors and device failures, the same attention must be paid to the choice and installation of the cabling as is paid to the rest of the system.
Cross-SSN Analysis in Multilayer Printed Circuit Boards
This article demonstrates how CST MICROWAVE STUDIO® has been applied to the Signal Integrity analysis of a multilayer PCB structure. Good agreement with measurement is shown as well as the results for a design suggestion to reduce coupling between planes.
3D Full Wave Cross-Talk Simulation of Multilayer PCB
The increased complexity of multilayer PCBs makes signal integrity studies with accurate 3D EM field simulators indispensable in order to optimize EMC performance. CST MICROWAVE STUDIO® is used to simulate a multilayered PCB, producing a good correlation...
3D EM simulation of mixed analog/digital multilayer PCB
This article describes the use of CST MICROWAVE STUDIO® (CST MWS) to solve a coupling problem in a mixed analog – digital multilayer PCB card.
Courtesy and permission of Alvarion, Ltd, Tel-Aviv, Israel.
This example gives an insight into the usefulness...
Cadence Allegro Import in CST STUDIO SUITE
An overview is given of the capabilities of the Cadence Allegro import feature in the CST STUDIO SUIT®. The user has full control over the layout export in Cadence itself and during the import process in CST STUDIO SUITE. Cross-section and packaging export...
Co-Simulation of a MMIC Low Noise Amplifier and a 3D via Hole Structure
CST DESIGN STUDIO™ has been used for a simultaneous optimisation of circuit elements with the built-in circuit simulator and the inductance of a 3D via hole model with CST MICROWAVE STUDIO®. For more complex layouts CST MWS 3D models can be used in Agilent...