Cables not only transfer the power needed to run electrical equipment,
but also the data signals needed to operate them. To prevent errors and device failures, the same attention must be paid to the choice and installation of the cabling as is paid to the rest of the system.
In this article CST MICROWAVE STUDIO® (CST MWS) is successfully employed to simulate and characterize a complex multilayered package model imported using the CST-Allegro link. The comparison of the simulated S-parameters with the measured data shows the...
Power Integrity Simulation for High Speed Board
This article presents the power integrity workflow using CST PCB STUDIO® for a high speed board. Power integrity analysis is performed in both DC and AC. Optimizing the PDN impedance in the frequency domain is one of the major goals in order to minimize...
RJ45 Interconnect Signal Integrity
An RJ45 connector model imported from Pro/E® is simulated in CST MICROWAVE STUDIO®. The time domain waveforms show good correlation to the TDR measurements. Model and results courtesy of North East Systems Associates (NESA).
Flip Chip Package Pre-Layout Study
This article describes how CST MICROWAVE STUDIO® is used to analyze the signal integrity of a flip chip package. The impact of having multiple ground planes in the package is clearly seen by the improvements to the insertion loss.
Signal Integrity (SI) analysis
This article highlights the modeling and simulation of signal integrity effects with CST PCB STUDIO® (CST PCBS). It explains how the technology (layer stackup) can be determined and which modeling options are available. Since SI investigations require...
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